Found 1 query results that match Chip Thermal Analysis

  • ANSYS CTA 2019 R2.1

    ANSYS CTA 2019 R2.1 Chip Package System Co-design Power integrity and signal integrity simulation for any IC should be performed with the proper noise model of the IC, along with the channel model of the package and board. ANSYS RedHawk for chip power modeling ANSYS RedHawk for chip signa.....
    Language : english Authorization: Retail Freshtime：2019-11-14 Size: 1CD